Wrap Technologies (WRAP)

Overall impact
C (42)

Commentary

Wrap Technologies is an average overall performer. With a 'C' rating of 42.1 for overall impact (26th percentile compared to all companies), Wrap Technologies ranks 20th out of 67 industry peers, behind Astrotech, Cpi Aerostructures, Mota Group and 16 others, and ahead of Amentum, AAR, Ontic Engineering & Manufacturing and 44 others. On top material causes for Wrap Technologies's industry (Aerospace & Defense), Wrap Technologies performs well in Free, Secure Flow of Information (95.4 score) and Technology Innovation (95.5) and performs poorly in Improved Mental Health (39.2 score), Healthy Oceans (34.5), Renewable Energy Growth (28.3) and 3 other causes where it received a 'D' or 'F' score.
Impact
Cause WRAP
Peer rank
Overall impact

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Company
Employees
25
Sector
Industrials
Industry
Aerospace & Defense
Sub-industry
Aerospace & Defense
SASB industry
Aerospace & Defense
Headquarters
Fl, United States
Share classes
WRAP
Description
Wrap Technologies, Inc., a public safety technology and services company, develops policing solutions for law enforcement and security personnel worldwide. The company offers BolaWrap 150, a handheld remote restraint device that discharges a seven-and-a-half-foot kevlar tether, entangling an individual from a range of 10 to 25 feet. Additionally, Wrap Technologies provides Wrap Intrensic, a body-worn camera and digital evidence management system for capturing, storing, and managing digital evidence, such as video and audio recordings for criminal investigations and maintaining transparency in public interactions. The company also offers Wrap Reality Virtual Training platform, a law enforcement 3D training system employing immersive computer graphics VR with proprietary software-enabled content. Wrap Technologies, Inc. was founded in 2016 and is headquartered in Miami, Florida.
Material causes
Ethos considers the following causes material for Wrap Technologies, based on its industry sub-industry Aerospace & Defense. Learn more about material causes in our methodology overview.

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