ACM Research, Inc., together with its subsidiaries, develops, manufactures, and sells capital equipment worldwide. It also develops, manufactures, and sells a range of packaging tools to wafer assembly and packaging customers.
The company provides Wet Cleaning Equipment for Front End Production Processes, including Ultra C SAPS II and Ultra C SAPS V, which are single-wafer, serial-processing tools used to remove random defects from wafer surfaces or interconnects and barrier metals as part of the chip front-end fabrication process or for recycling test wafers. Additionally, it offers Ultra C TEBO II and Ultra C TEBO V, a single-wafer, serial-processing tool used at numerous manufacturing processing steps for cleaning of chips at process nodes of 28nm or less.
In addition, it offers the Ultra-C Tahoe wafer cleaning tool that delivers high cleaning performance using significantly less sulfuric acid and hydrogen peroxide than is typically consumed by conventional high-temperature single-wafer cleaning tools. The company also provides advanced packaging tools, such as coaters, developers, photoresist strippers, scrubbers, wet etchers, and copper-plating tools.
Furthermore, the company provides the Ultra fn Furnace, a dry processing tool; the Ultra Pmax" PECVD tool for film uniformity; and the Ultra Track tool, a 300mm process tool that delivers air downflow, robot handling, and customizable software to address specific customer requirements. It also offers a suite of semi-critical cleaning systems, which include single wafer back side cleaning, scrubber, and auto bench cleaning tools.
ACM Research, Inc. markets and sells its products under the SAPS, TEBO, ULTRA C, ULTRA Fn, Ultra ECP, Ultra ECP map, and Ultra ECP ap trademarks through a direct sales force and third-party representatives. ACM Research, Inc. was incorporated in 1998 and is headquartered in Fremont, California.
