Shinko Electric Industries (6967.T)

Shinko Electric Industries Co., Ltd. develops, produces, and sells various semiconductor packages in Japan. The company manufactures and sells plastic laminated packages, leadframes, glass-to-metal seals, heat spreaders, arresters, and ceramic electrostatic chuck products; IC packages; and assembles system modules. It also offers various substrates comprising flip-chip package, plastic-BGA, coreless, and 2.3D package; and supplies various metal products. In addition, the company provides molded core embedded package, a compact and thin package, that consists of IC chips and active/passive components for use in small-sized electronic devices and various modules. This includes bare die flip-chip packages; molded underfill flip-chip packages; high-heat-dissipation flip-chip packages; and copper pillars, as well as glass-to-metal seals; and CAN packages for high-speed optical communication. It serves computer and networking, mobile, industrial and IoT, and automotive industries. The company was incorporated in 1946 and is headquartered in Nagano, Japan. Shinko Electric Industries Co., Ltd. operates as a subsidiary of Fujitsu Limited.